DTS Interconnect with Pre-sintered Silicon Nitride AMB Substrate for Power Module Applications

Increased power density and operating temperature of a power module requires more efficient and higher reliable interconnection to fulfill the demands. Heraeus Electronics developed the Die Top System to enable copper wires or ribbons on top of the die.

The combination of the Die Top System and power copper wire or ribbon can maximize the power density and power cycling reliability as well as the lifetime of a power module. Matched pre-applied sinter paste and functional surface of the Si3N4 AMB substrate provides robust and simplified die assembly results in improved die shear strength and reliability. Pre-applied sintering is a cost-effective alternative to sinter film.

Pre-sintered metal ceramic substrates are an alternative for module manufacturers who look for simplified production processes and prefer to use pre-applied sinter material instead of printing paste.

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