The combination of the Die Top System and power copper wire or ribbon can maximize the power density and power cycling reliability as well as the lifetime of a power module. Matched pre-applied sinter paste and functional surface of the Si3N4 AMB substrate provides robust and simplified die assembly results in improved die shear strength and reliability. Pre-applied sintering is a cost-effective alternative to sinter film.
Pre-sintered metal ceramic substrates are an alternative for module manufacturers who look for simplified production processes and prefer to use pre-applied sinter material instead of printing paste.