Welco® AP519: Low Temperature No-Clean Printing Paste

Welco® AP519 T6 solder paste is a low-temperature, state-of-the-art no-clean, lead-free solder paste formulated with Heraeus proprietary Welco® powders. It is specifically designed for processes that require a low peak reflow temperature of ≤170°C, including BGA, SMD component or flip-chip attach processes for fine pitch semiconductor packages such as System-in-Package (SiP), package-on-Package (PoP) etc.

Key Features

  • Uses high-quality Welco® Type 6 powders
    • Narrow size distribution
    • Uniform spherical shapes
    • Batch-to-batch consistency
  • Low peak reflow temperature at 170 ºC
  • Best-in-class low-void performance
  • Excellent fine pitch paste release
  • Long stencil life (≥8hr) & long staging life (≥8hr)
  • Colorless flux residue after reflow

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