SMT has largely replaced the former through-hole technology for the assembly of electronic circuits on PCBs and ceramics. Since SMT components have either smaller or no leads, they are usually smaller than through-hole components. This leads to a much higher component and weight reduction.
For the setup of an optimal and cost effective production process, it is necessary to find the optimal combination of powder and flux of the solder paste depending on application and substrate. A comprehensive portfolio helps to match the configuration of the solder paste to the requirements of the process. Heraeus produces powder, flux and paste in four different locations. Our decentral solder powder production process guarantees highest yields, consistency and reliability.
Heraeus solder pastes guarantee the perfect match to various applications. With the InnoRel series in combination with the Innolot® alloy we offer proven high reliability solder pastes for the automotive electronics industry: InnoRel series are high reliability lead-free alloys for applications on epoxy based PCBs and on ceramic substrates.
For ceramics, e.g. Hybrids, LTCC or DBC, the HT1 alloy is recommended. Material cost topics can be addressed by low silver containing lead-free alloys, leading to viable solutions - even for high reliability applications. With a wide range on “green” products (lead-free, halogen-free or even zero-halogen) for automotive, industrial and consumer electronics, Heraeus meets the growing demand of environmentally friendly production processes.
Beyond our standard portfolio we are able to design solutions for your special applications. Our application centres allow us to test the adaptions directly and to optimize them to achieve a superior product quality.