• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: AgPd
  • Application: Hybrid IC
  • Description: C2129A is a high performance mixed bonded Ag/Pd conductor material. It offers cost savings over standard Ag/Pd formulations while maintaining the advantages of leach resistance and aged adhesion. C2129A is also aluminum wire bondable. C2129A is supplied with a rheology, which results in a dense, uniform fired film.
  • Key features: Low cost#Excellent solderability and leach resistance#Low resistivity#Good Al wire bond adhesion (initial and aged)
  • Process Temperature: 850 °C peak temperature. Dwell time at peak temperature for 10 minutes.
  • Film Thickness : 10-15 um
  • Viscosity: 120-180 Kcps Brookfield HBTSC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Conductivity: ≤ 6.0 milliohms/square at 12 um fired film thickness
  • Solids: 80.0 ± 1.0 %
  • Alloy Ratio: 30:01:00

Discuss your solution

Talk to our experts and find the optimal solution for your applications.