• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: AgPt
  • Application: Hybrid IC
  • Description: C4774 is a silver/platinum (3:1) conductor paste designed for high leach resistant applications using aluminium nitride substrates. C4774 also has excellent adhesion and solderability.
  • Key features: Excellent leach resistance#Excellent solderability#Excellent adhesion on aluminum nitride
  • Conductivity: 80-100 at 12 um fired film thickness
  • Alloy Ratio: 03:01

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