- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: Cu
- Application: Power / LED
- Description: C7403 / C7404A is a ENIG plateable, wire bondable copper conductor system developed for applying thick layers of copper. It is optimized for lapped AlN substrates as well as 96 % alumina. It is intended for use where cost sensitive applications involving high thermal and electrical properties are required. C7403 / C7404A are applied by screen printing, dried in air and fired in a nitrogen atmosphere. C7403 is applied by printing as the base layer. C7404A is printed on top of C7403 to build the thick layered film up to 300 um.
- Key features: Compatible with AIN and Al2O3#Excellent electrical and thermal properties#Excellent fired film density#High fired film thickness (up to 300 um) ENIG and ENEPIG plateable#Wire bondable-thick Al wire
- Process Temperature: Fire in Nitrogen with O2 between 2-10 ppm 925-950 ºC peak. Dwell time of 8-10 minutes.
- Film Thickness : 5 layers of C7404A can be printed to achieve a fired film thickness of up to 300 um.
- Viscosity: C7403: 120-220 KcpsC7404A: 150-250 KcpsBrookfield HBT, SC4-14 at 10 rpm, 25 °C
- Conductivity: < 3.0 milliohms/square at 12 um fired film thickness
- Alloy Ratio: 100
C7403 - C7404A
Discuss your solution
Talk to our experts and find the optimal solution for your applications.