• Paste Type: Conductor
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: Ag
  • Application: Hybrid IC
  • Description: C8708 is a screen printable, pure silver paste designed as a hole plug in alumina substrates. The high solids loading allows for excellent filling properties. C8708 has low shrinkage, which allows for a complete fill of the through hole.
  • Key features: High solids loading#Low shrinkage#Stencil printing to fill through holes
  • Process Temperature: 850 °C peak temperature. Dwell time of 8-12 minutes at peak.
  • Viscosity: 200-300 Kcps Brookfield HBTSC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Conductivity: ≤ 8 milliohms/square at 25 um fired film thickness
  • Alloy Ratio: 100

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