- Paste Type: Conductor
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: AgPtPd
- Application: Hybrid IC
- Description: CL49-8217A is a Ag/Pd/Pt formulation which provides outstanding leach resistance and aged adhesion with many types of solder. This material has excellent silver migration resistance.
- Key features: Excellent Ag migration resistance#Outstanding leach resistance
- Process Temperature: 850 °C peak temperature. Dwell time of 9-11 minutes.
- Film Thickness : 6-10 um
- Viscosity: 270 – 310 Kcps Brookfield HBT SC4 – 14 spindle, 6R cup at 10 rpm, 25 °C
- Conductivity: ≤ 225 milliohms/square at 8.5 um fired film thickness
- Solids: 71.0 ± 1.0 %
CL49-8217A
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