- Paste Type: End Termination
- Application Method: Dipping
- Substrate: MLCC
- Metal: AgPt
- Application: Capacitor - MLCC, chip
- Description: ET1826 is a solderable Ag/Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). ET1826 offers excellent solderability and adhesion. ET1826 is supplied at a viscosity suitable for machine dip and blot or no blot applications
- Key features: Suitable rheology for machine dip application#Excellent solderability and adhesion#Compatible on titanate ceramic bodies
- Process Temperature: 780-810 °C at peak temperature. Dwell time of 5-6 minutes at peak.
- Viscosity: 25-35 Kcps Brookfield RVT SC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
- Paste Function: Solderable
ET1826
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