• Paste Type: End Termination
  • Application Method: Dipping
  • Substrate: MLCC
  • Metal: Ag
  • Application: Varistor - MLV, chip, disc
  • Description: ET1894 is low firing plateable silver end termination designed for application on to MLV chip components. The rheology is suitable for maching dipping applications.
  • Key features: Nickel plateable#Excellent fired film density and adhesion
  • Process Temperature: 560-580 °C peak temperature. Dwell time of 5-7 minutes at peak 45 minutes firing cycle.
  • Viscosity: 35-45 Kcps Brookfield RVT SC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Alloy Ratio: 100
  • Paste Function: Plateable

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