• Paste Type: Dielectric / Glaze
  • Application Method: Screen Printing
  • Substrate: Aluminum Nitride
  • Metal: None
  • Application: Hybrid IC
  • Description: IP9002 is a Pb, Cd, and Ni free low firing green overglaze that is resistant to various plating solutions. It has a low thermal expansion coefficient allowing for applications which utilize aluminum nitride substrates. It is compatible with various Heraeus conductors designed for aluminum nitride.
  • Key features: Excellent plating solution resistance#Pinhole free#Low thermal expansion coefficient (CTE)#Chemically durable
  • Process Temperature: 500-600 °C peak temperature. Dwell time of 5-7 minutes.
  • Film Thickness : 8-12 um
  • Viscosity: 60-80 Kcps Brookfield HBTSC4-14 spindle, 6R utility cup at 10 rpm, 25 °C
  • Solids: 76.0 ± 2.0 %

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