- Paste Type: Dielectric / Glaze
- Application Method: Screen Printing
- Substrate: Alumina
- Metal: None
- Application: Hybrid IC
- Description: IP9117 is a permanent blue 850 °C firing dielectric composition, displaying the following benefits:
- Key features: Expansion coefficient is closely matched with that of alumina, to provide for minimal substrate bowing#Extremely dense, hermetic fired film allows for excellent electrical performance at a fired thickness of ≥ 40 um#Excellent solderability and adhesion of Ag#Ag/Pd, Ag/Pt, Au and Au/Pt conductors on top of dielectric#Excellent wire bondability of gold conductors on top of dielectric#Resistors can be processed on top of dielectric#Absence of the “Battery Effect”3
- Process Temperature: All layers of the interconnected structure should be fired separately. Fire in air, with a 30-60 minute cycle to a peak temperature of 850 °C.
- Film Thickness : ≥ 40 um (3 separately fired layers)
- Viscosity: 30-50 Pas (25 °C, D = 75/s)
- Rel. Dielectric Constant K: 7.5-9.5 (25 °C, 1 kHz)
- Dissipation Factor: ≤ 0.5 % (25 °C, 1 kHz)
- Insulation Resistance: ≥ 1012 ohm xcm (25 °C)
- Breakdown Voltage : ≥ 500 V (per 40 um total FFT)
IP9117
![IP9117 IP9117](https://pim.heraeus.com/images/HET/TFM/DielectricPaste.jpg)
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