• Paste Type: Dielectric / Glaze
  • Application Method: Screen Printing
  • Substrate: Alumina
  • Metal: None
  • Application: Hybrid IC
  • Description: IP9117 is a permanent blue 850 °C firing dielectric composition, displaying the following benefits:
  • Key features: Expansion coefficient is closely matched with that of alumina, to provide for minimal substrate bowing#Extremely dense, hermetic fired film allows for excellent electrical performance at a fired thickness of ≥ 40 um#Excellent solderability and adhesion of Ag#Ag/Pd, Ag/Pt, Au and Au/Pt conductors on top of dielectric#Excellent wire bondability of gold conductors on top of dielectric#Resistors can be processed on top of dielectric#Absence of the “Battery Effect”3
  • Process Temperature: All layers of the interconnected structure should be fired separately. Fire in air, with a 30-60 minute cycle to a peak temperature of 850 °C.
  • Film Thickness : ≥ 40 um (3 separately fired layers)
  • Viscosity: 30-50 Pas (25 °C, D = 75/s)
  • Rel. Dielectric Constant K: 7.5-9.5 (25 °C, 1 kHz)
  • Dissipation Factor: ≤ 0.5 % (25 °C, 1 kHz)
  • Insulation Resistance: ≥ 1012 ohm xcm (25 °C)
  • Breakdown Voltage : ≥ 500 V (per 40 um total FFT)

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