• Paste Type: LTCC
  • Application Method: Screen Printing
  • Substrate: LTCC
  • Metal: Ag
  • Application: LTCC
  • Description: TC0308A is a pure Ag via fill which provides excellent compatibility with HeraLock® HL2000 and Clad CT800 during the cofiring process. After firing it results in a dense filled via with minimal posting.
  • Key features: Low resistivity#Compatible with HeraLock® HL2000#Minimal posting
  • Process Temperature: See HeraLock® HL2000 data sheet
  • Viscosity: 300-600 KcpsCone and Plate 25/1 cone at 0.052 mm gap at 10 sec-1, 25 °C

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