- Paste Type: LTCC
- Application Method: Screen Printing
- Substrate: LTCC
- Metal: Ag
- Application: LTCC
- Description: TC0308A is a pure Ag via fill which provides excellent compatibility with HeraLock® HL2000 and Clad CT800 during the cofiring process. After firing it results in a dense filled via with minimal posting.
- Key features: Low resistivity#Compatible with HeraLock® HL2000#Minimal posting
- Process Temperature: See HeraLock® HL2000 data sheet
- Viscosity: 300-600 KcpsCone and Plate 25/1 cone at 0.052 mm gap at 10 sec-1, 25 °C
TC0308A
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