Major Suppliers in electronics assembly materials awarded U.S. Patent for Innolot/Loctite 90ISC Alloy Providing High Reliability for High-Temperature Applications

(Waterbury, CT USA) – May 13, 2020 – Three major suppliers in electronics assembly materials, MacDermid Alpha Electronics Solutions, Henkel, and Heraeus, received notice that the United States Patent and Trademark Office has issued Patent No. US10376994B2 for their innovative solder alloy formulation marketed under the brand names Innolot (Heraeus & Alpha) and Loctite 90ISC (Henkel). The patent was granted an extended expiration to June 11, 2029.

pressemitteilung

The technology was developed in a cooperative project to produce a lead-free solder alloy specifically for harsh environment electronics applications. The result was an alloy with markedly improved reliability performance as compared to standard SAC alloys. Promoted in the electronics market for over ten years, the respective Innolot and Loctite 90ISC products are widely recognized as a high-reliability, thermal cycling, thermal ageing and vibration-resistant alloy, making it well suited for automotive applications and assemblies. The Innolot/90ISC alloy is designed to tolerate the demands of high-temperature applications while still being solderable at standard lead-free process temperatures.

The issuance of the U.S. patent is a further achievement for MacDermid Alpha, Henkel, and Heraeus and their efforts towards creating innovative materials for the challenges and demands of today’s electronics assembly. “The issuing of this patent is of strategic and commercial importance,” said Tom Hunsinger, Vice President of Marketing MacDermid Alpha Electronics Solutions, “Coupled with patent protection in Europe and Japan, this will help drive new business opportunities not only in automotive but in other markets with harsh environment challenges.”

MacDermid Alpha Electronics Solutions, Henkel, and Heraeus market Innolot and Loctite 90ISC products in a variety of forms including solder paste, bar solder, and wire. Patents are currently held in EU (EP1617968B1) and Japan (JP5320556B2).

For more information, contact:

MacDermid Alpha Electronics Solutions:
Tom Hunsinger
Tom.Hunsinger@macdermidalpha.com

Henkel:
Sebastian Hinz
Sebastian.Hinz@henkel.com

Heraeus:
Sofie Volk
Sofie.Volk@heraeus.com