APEC 2019

Heraeus Electronics at APEC 2019 in Anaheim, CA

Power Your Business with Matched Materials Solutions

The Complete Power Packaging Solution

Power Your Business with Matched Materials Solutions

For Power Electronic solutions and engineering advancements the industry turns to Heraeus Electronics. With the ever-growing need for power electronics Heraeus understands the needs to cut down on costs while still maintaining high reliability. Heraeus addresses these needs by supplying quality materials combined with engineering know-how to package our products for the most reliable solution.

Meet our product and technical experts at APEC 2019

Venue: Anaheim Convention Center
March 17-21, 2019
Booth# 564

Sinter Materials

mAgic PE338-pressure Sinter on SiC

mAgik PE338-pressure Sinter on SiC
  • Patented pure Ag interconnect on bare copper surfaces
  • Optimized for applications with SiC power devices
  • High thermal conductivity for operating temperatures up to 250c
  • Highly reliable material that increases lifetime performance
  • High electrical conductivity, which improves device efficiency
  • No flux residue, no cleaning required.

Other Product Highlights at APEC 2019