Heraeus at Trusttech 2019

Heraeus at Trustech 2019

Discover new developments in Payments, Identification and Security at Trustech 2019. Find out more about our latest innovation XOB10 - the world's thinnest leadframe - and learn how it makes smart card modules thinner, securer and stronger.

Meet our experts at Trustech which takes place from November 26th - 28th, 2019 in Cannes, France. Visit us at Booth #K46 to speak with our technical experts and learn more about our innovative materials and solutions.

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How to make your smart card module thinner, securer and stronger?

XOB 10

Heraeus’ XOB10 is the world’s thinnest leadframe with a thickness of just 35µm. Its ultra-thinness enables a broad range of applications with a module thickness of 200µm or even lesser! XOB10 is designed in line with the trend of miniaturization to meet the ever increasing safety requirements for secure ID applications such as contactless payment and ePassports. The thickness reduction of the lead frame and thus the module allows card manufacturers to integrate additional security layers such as holograms and foils.

The new breakthrough is yet another solution to blend the creative innovation into our everyday lives by producing lighter, smaller and securer products for a tech-savvy generation.

 Learn more about XOB10 here.

Meet our experts at Trustech 2019

Interested to discuss your specific requirement? Schedule an appointment with our experts.

Damian Gornik, Global Product Manager Metal Substrates

Damian Gornik

Global Product Manager Metal Substrates
Michael Benedikt, Technical Solutions Manager EMEA

Michael Benedikt

Technical Solutions Manager EMEA