Join Heraeus Electronics at APEC 2023

Visit Heraeus Electronics at APEC 2023 in Orlando!

Are you interested in learning about the latest technologies in the power electronics industry?

Heraeus will have experts onsite presenting a variety of our innovative product lines, including power wire, pressure sinter pastes and our Condura® line. We are excited to discuss our newest addition to this line, the Condura®.ultra Ag-free AMB Substrate.

Stop by our booth to talk to our experts:

  • Exhibition date: 21 - 22 March 2023
  • Heraeus Booth No. #534
  • Venue: Orange County Convention Center, Orlando | Florida

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Key benefits of mAgic® PE338:

  • Improves device reliability
  • High thermal conductivity for longer lifetime
  • High electrical conductivity improves device efficency
  • Enables high operating temperature
  • Lead-free and halogen zero formulation for environmental compliance
  • No flux residue, no cleaning required
  • Consistent printing performance
  • Long stencil life

 Find out more

Key benefits of PowerCu-Soft Laser Ribbons:

  • Tailor-made surface
  • Extreme softness
  • Best thermal stability
  • Uniform fine grain structure
  • Advanced mechanical properties for optimized technologies
  • Highest Cu purity for lowest electrical resistance
  • Replaces up to 3 single Cu wires

 Find out more

Key benefits of DTS:

  • Die current capability increases >50 % vs. Aluminum wire
  • > 50x longer lifetime vs. solder die attach and Al-wire
  • Reduced peak temperature across the die
  • Enables higher junction temperatures of more than 200 °C
  • Superior robustness vs. other solutions (e.g. clips)

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Choose the right product for your challenge

  • Condura®.ultra - outstanding relibility and processing
  • Condura®.extra - enhanced mechanical robustness
  • Condura®.prime - high-reliable power modules
  • Condura®.classic - excellent performance/cost efficiency ratio

 Find out more

Interested in talking to our experts? Make an appointment to meet us at APEC 2023.

Trade show dates:

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