Continuing a Strong Bond

Advancing the next technological challenge with Heraeus Electronics

Heraeus Electronics at SEMICON Taiwan 2021

5G, Internet of things (IoT), and Artificial Intelligence (AI) continue to be major trends driving today’s semiconductor industry. ​

Our innovative material solutions enable customers to develop new keys for higher current density, addressing integration challenges, and to answer the demand for improved reliability, miniaturization and cost efficiency. Leveraging our soon-to-be-opened Advanced Packaging Application Center in Taiwan, local customers can benefit from shorter development cycles, faster time to market, local technical expertise to solve complex systems, reduced development risks, and the efficient use of resources.​

Stop by our booth to learn more:

  • Date: 28 - 30 December 2021
  • Venue: 1F & 4F, Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1)
  • Heraeus Booth No. I2300, 1F (Materials Pavilion)​

More information about SEMICON Taiwan 2021

Product Highlights at SEMICON Taiwan

Expert Presentation at TechXPOT

Vito Hsu
  • Topic: Moving forward with Heraeus Electronics. Advanced Packaging. Sustainability. New Apllication Center
  • Date: 28 December 2021
  • Time: 3:00 - 3:20pm
  • Venue: 1F TechXPOT stage
  • Presenter: Mr. Vito Hsu, Senior Technical Solution Manager, Heraeus Electronics