Heraeus Electronics at SEMICON Taiwan 2022

​With 5G, Internet of things (IoT), and Artificial Intelligence (AI) continue to disrupt and shape the semiconductor industry, new innovative material solutions are required to support the next generation packages.

Heraeus Electronics’ latest materials portfolio enables customers to develop new keys for higher current density, addressing integration challenges, and answering the demand for improved reliability, miniaturization and cost efficiency. Leveraging our new Advanced Packaging Application Center in Taiwan, local customers benefit from shorter development cycles, faster time to market, local technical expertise to solve complex systems, reduced development risks, and the efficient use of resources.​

Stop by our booth to learn more:

  • Date: 14 - 16 September 2022
  • Venue: TaiNEX 1, Taipei
  • Booth #L0426, 4F (Materials Pavilion)

More information about SEMICON Taiwan 2022

New Product Highlights at SEMICON Taiwan

Expert Presentation at TechXPOT

  • Topic: Latest Materials To Further Elevate Your Device Performance Moving forward with Heraeus Electronics. Advanced Packaging. Sustainability. New Apllication Center
  • Date: 14 September 2022
  • Time: 2:20 - 2:40pm
  • Venue: 4F TechXPOT (Booth #L1200)
  • Presenters:
    • Mr. Dennis Ang, Global Product Manager for Die Attach and Sinter Materials
    • Mr. Zhang HanWen, Global Product Manager for Advanced Packaging Materials