Conductive Adhesives for Automotive and Consumer Electronics

Manufacturing processes in the electronics industry need to be simple, automated and efficient. They also need to deliver high reliable results. This is why die attach adhesives should come in a one-component solution and have to offer excellent conductivity at high reliability. Low silver adhesive solutions help to manage the costs.

Conductive Adhesives

Isotropic Conductive Adhesives (ICA) are used for attaching dies and SMT components on LTCC / ceramic substrates in the automotive industry. They are also utilized for die attach on lead frame and flexible substrates in consumer electronics. Both industries have high requirements in terms of reliability, simplification and costs.

Heraeus offers a one component thermo-setting epoxy adhesive with excellent properties to meet these challenges.

Our solvent-free and lead-free conductive adhesives enable a simple and stable manufacturing process and are available for dispensing and printing applications.

All our products can directly be tested in our application center.

Your benefits at a glance:

  • Excellent electrical and thermal performance
  • One component ready-to-use solution for simple and stable processing
  • High reliability solution due to excellent thermo cycling performance
  • Low silver solution for good cost performance
  • Solvent-free and lead-free adhesives
  • Fast curing and low temperature curing series

Your advantage in working with Heraeus:

  • Pretested solutions due to our in-house application centre
  • Exactly the right solution for your application, adapted to your needs

Automotive:

Heraeus conductive adhesives are used for die attach and SMT component attach on LTCC / ceramic substrates in automotive applications:

  • Motor management
  • Safety equipment
  • Sensors


Consumer electronics:

Heraeus conductive adhesives are used for die attach on lead frame and flexible substrates in consumer electroincs applications:

  • Smartcards
  • RFID cards
  • Camera modules
  • LED
Product Name Application Method Curing Temperature * Application
 PC3000 Screen Print 10 min / 150 °C or 20 min / 120 °C (Standard Curing) Hybrid circuit attachment of dies, SMT / SMD component on LTCC / ceramic for automotive applications.
 PC3001 Dispense 10 min / 150 °C or 20 min / 120 °C (Standard Curing) Hybrid circuit attachment of dies, SMT / SMD component on LTCC / ceramic for automotive applications.
 PC3002 Stencil Print 10 min / 150 °C or 20 min / 120 °C (Standard Curing) Hybrid circuit attachment of dies, SMT / SMD component on LTCC / ceramic for automotive applications.
 PC3601 Dispense 3 min / 150 °C or 80 min / 120 °C (Low Temperature Curing) Die & passive component attach on PCB for automotive applications (also components) camera modules.