Small-Diameter Aluminum Wedge Bonding Wire

In the race to get electronic products to market fast while keeping costs under control, high-purity fine aluminum-alloy bonding wire from Heraeus can help you succeed.

Small-Diameter Aluminum Wedge Bonding Wire

The small-diameter aluminum wedge bonding wire available from Heraeus is made of high-quality AlSi1 alloy (99% aluminum and 1% silicon) and goes by the brand name of AlW-29S. Its principal applications are in motor vehicles, consumer electronics, and computers.

In contrast to heavy aluminum wire, which is used to carry power, fine aluminum bonding wire is dedicated for signal transmission and processing. It is commonly used for Chip-On-Board (COB) applications. AlW-29S aluminum-alloy wire include compatibility with the aluminum on IC bonding pads, especially in fine-pitch applications. It can be easily and cost-effectively bonded at room temperature and is thus ideal for forming high-integrity bonds and preventing damage to sensitive devices. The electrical and thermal conductivity properties of ALW-29S are also excellent for a wide range of uses.

Compared to other suppliers, aluminum bonding wires belong to our strategic core business. We are capable to match it to our comprehensive assembly material program and therefore reach better reliability, performance, and workability.

This helps you to speed up your development and optimization processes, and bring your products to market faster.

Small-diameter aluminum wedge bonding wire from Heraeus may be just the solution you’re looking for.

Your benefits at a glance:

  • Available in many configurations for a wide range of wedge bonding applications
  • Excellent electrical and thermal conductivity
  • Relatively high fusing current
  • Specially developed for chip-on-board (COB) applications
  • Excellent bondability due to homogeneous chemical composition, stable mechanical properties, and smooth and clean wire surfaces
  • Highly reliable bonding in fine-pitch applications, being compatible with aluminum package metallization
  • Room-temperature bonding at low energy levels, which helps prevent damage to sensitive devices while ensuring high-integrity bonds
  • Three hardness grades, letting you choose the best one for your bonding process
  • A very wide bonding process window
  • Conformity with all major bond test standards
  • Compliance with legal requirements including REACH and RoHS
  • Motor vehicle electronics
  • Consumer electronics
  • Computing equipment
  • Chip-On-Board (COB) technology
  • Bonding of discrete components (diodes, transistors, capacitors, resistors)
  • Bonding of hybrid components

Technical data of AlW-29S and AlW-29S-CR (corrosion-resistant):

Technical data of AlW-29S and AlW-29S-CR (corrosion-resistant):

Usually supplied on 2x1 or 2x2 Al-DN spools with 100, 500 or 1000 m each.
Please contact us for information on other supply forms and diameters.

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