Condura^®+

Services beyond the product: Choose your PLUS to maximize your success in power electronics module production.

• Ceramic thickness:Different thicknesses available, depending on the ceramic type
• Customized warpage
  Master card with tuned warpage in direction and amplitude
• Copper thickness
  Different thicknesses available, depending on the ceramic type
• Surface finish
  • Cu, Ni, NiAu, Ag, Brushing
• Laser scribing for singulation
  Innovative laser process which eliminates material residues
• Customized dimples
  For stress relief in Condura®.classic and Condura®.extra
• Grinding
  A mechanical surface treatment to ensure optimal bonding

• Burr-free holes (Laser cut-out)
  Innovative laser cutting process for burr-free holes
• Data Matrix Code
  Continuous traceability
• Automated Optical Inspection (AOI)
  Implement high level QA procedure
• Ultrasonic testing
  Non destructive control of the interface between copper and ceramic
• Customized packing
  Customer specific packing

• Pre-applied solder
  • No more solder paste printing & flux cleaning
  • Take responsibility through pre-applied material system
  • Reduce yield losses
  • Process simplification
  • No solder stop (dimples or solder mask)

Read more:  Condura®+ alumina substrate with pre-applied solder

• Pre-applied sinter paste
  • No more sinter paste printing & drying
  • Take responsibility through pre-applied material system
  • Reduce yield losses
  • Process simplification
  • Reduces costs

• Matching materials
  Select matched joining material
• Design
  Layout of conductive layers, die and components placement
• Thermal simulation
  Simulation of temperature distribution e.g. for hot spot prediction
• Prototyping:
  • Module prototyping and metal ceramic substrates assembly
  • Functional prototypes for metal ceramic substrates validation

• Active power cycling
  Testing of power modules or assembled metal ceramic substrates
• Testing
  Tests on bare or assembled metal ceramic substrates
• Analytics:
  • Failure analysis
  • Analysis of functional surfaces