Condura®+

Services beyond the product: Choose your PLUS to maximize your success in power electronics module production.

Condura®+
Choose your PROPERTY PLUS

Property Plus
  • Ceramic thickness:Different thicknesses available, depending on the ceramic type
  • Customized warpage
    Master card with tuned warpage in direction and amplitude
  • Copper thickness
    Different thicknesses available, depending on the ceramic type
  • Surface finish
    • Cu, Ni, NiAu, Ag, Brushing
  • Laser scribing for singulation
    Innovative laser process which eliminates material residues
  • Customized dimples
    For stress relief in Condura®.classic and Condura®.extra
  • Grinding
    A mechanical surface treatment to ensure optimal bonding

Condura®+
Choose your OPTION PLUS

Condura®+ OPTION PLUS
  • Burr-free holes (Laser cut-out)
    Innovative laser cutting process for burr-free holes
  • Data Matrix Code
    Continuous traceability
  • Automated Optical Inspection (AOI)
    Implement high level QA procedure
  • Ultrasonic testing
    Non destructive control of the interface between copper and ceramic
  • Customized packing
    Customer specific packing

Condura®+
Choose your PROCESSING PLUS

Processing Plus
  • Pre-applied solder
    • No more solder paste printing & flux cleaning
    • Take responsibility through pre-applied material system
    • Reduce yield losses
    • Process simplification
    • No solder stop (dimples or solder mask)

Read more: Condura®+ alumina substrate with pre-applied solder

  • Pre-applied sinter paste
    • No more sinter paste printing & drying
    • Take responsibility through pre-applied material system
    • Reduce yield losses
    • Process simplification
    • Reduces costs

Condura®+
Choose your SERVICE PLUS

Service Plus
  • Matching materials
    Select matched joining material
  • Design
    Layout of conductive layers, die and components placement
  • Thermal simulation
    Simulation of temperature distribution e.g. for hot spot prediction
  • Prototyping:
    • Module prototyping and metal ceramic substrates assembly
    • Functional prototypes for metal ceramic substrates validation
  • Active power cycling
    Testing of power modules or assembled metal ceramic substrates
  • Testing
    Tests on bare or assembled metal ceramic substrates
  • Analytics:
    • Failure analysis
    • Analysis of functional surfaces

Interested to discuss your challenge with our experts?