Power semiconductors faced a challenging issue between performance and reliability. Increased power density drives devices to operate at higher temperature which affect lifetime.
New innovative interconnect materials are required to overcome this thermal bottleneck. Formulated with patented micro-Ag technology to sinter at a low temperature of 200 ⁰C, mAgic® DA295A creates a robust pure silver die-attach layer with high thermal dissipation compared to traditional solder and adhesive materials.
Increased complexity in semiconductor design package raises new assembly difficulties. By mirroring closely present manufacturing processes, mAgic® DA295A simple processing provides flexibility. Improved workability characteristics benefit manufacturability.
mAgic® DA295A superior thermal conductivity enables power devices to operate at elevated temperature and extends device lifetime. It is suitable for high power and high reliability power semiconductors (RF power amplifiers) and power discrete (power MOSFET, diodes, thyristors, etc) packages.
Key benefits of mAgic® DA295A:
- Zero halogen
- Stable rheology
- Excellent dispensing performance
- Consistent adhesion on Au surface
- Low temperature processing (200 ⁰C and above)
- No cleaning required