HPC is increasingly prevalent in everyday life, with specific applications in processors for Artificial Intelligence applications, GPU and CPUs for gaming computers and consoles, mobile processors for 5G smartphones, autonomous driving, memory controllers and more. High bump-count and fine bump-pitch flip chips are the enabling technology for HPC and need to be reliably soldered onto substrates. This advanced packaging process faces huge challenges to eliminate defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. A carefully designed flux material plays an essential part in addressing these defect challenges.
AP500 is a water-soluble, halogen-zero tacky flux specifically engineered for ultra-fine bump-pitch flip chip attach and BGA attach applications. AP500 flux delivers superior wettability on various pad finishes such as Copper Organic Solderability Preservative (CuOSP) and Electroless Nickel Immersion Gold (ENIG), and offers a long work life and easy cleanability by DI water after reflow.