Driven by form factor, the number of components in SiP are increasing while package size continues to stay tiny. This creates challenges for solder materials. Furthermore, short time to market for new products becomes a crucial strategic advantage in a highly competitive environment of communications, computer and consumer market segments.
WelcoTM AP5112 is a water-soluble, halogen-free paste that has excellent printability due to its excellent inherent rheological properties, offering superior fine pitch printing performance. Stencil life for WelcoTM AP5112 is typically greater than 7 hours.