Heraeus Electronics returns to IPC APEX EXPO in San Diego from January 25-27 to showcase the latest solder solutions for automotive electronics at booth #1549.
This year Heraeus Electronics will feature:
Heraeus Electronics returns to IPC APEX EXPO in San Diego from January 25-27 to showcase the latest solder solutions for automotive electronics at booth #1549.
This year Heraeus Electronics will feature:
Innolot® High Reliability Alloy for Automotive Applications - Extreme environmental stresses and increased component performance requirements of electronic components need optimized solutions. Innolot® enables high performing solder joints for the harsh conditions in the automotive industry.
Microbond® SMT650 - High reliability solder paste achieves a consistently high surface insulation resistance that prevents electrochemical migration. Combining the new F650 flux system with the Innolot® alloy delivers superior reliability—particularly in miniaturized systems in the automotive industry.
Heraeus Electronics Microbond® SMT650
Microbond® SMT645 - Heraeus offers a series of no-clean solder pastes for standard and miniaturized automotive applications. A flexible flux platform achieves excellent wetting results on various surfaces and combination with various alloys.
Heraeus Electronics Microbond® SMT645
For more information on Heraeus Electronics solder solutions please contact manunoe.vaidya@heraeus.com