Continuing a Strong Bond

Advancing the next technological challenge with Heraeus Electronics

Heraeus Electronics at SEMICON Taiwan 2021

5G, Internet of things (IoT), and Artificial Intelligence (AI) continue to be major trends driving today’s semiconductor industry. ​

Our innovative material solutions enable customers to develop new keys for higher current density, addressing integration challenges, and to answer the demand for improved reliability, miniaturization and cost efficiency. Leveraging our soon-to-be-opened Advanced Packaging Application Center in Taiwan, local customers can benefit from shorter development cycles, faster time to market, local technical expertise to solve complex systems, reduced development risks, and the efficient use of resources.​

Stop by our booth to learn more:

  • Date: 28 - 30 December 2021
  • Venue: 1F & 4F, Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1)
  • Heraeus Booth No. I2300, 1F (Materials Pavilion)​

More information about SEMICON Taiwan 2021

Product Highlights at SEMICON Taiwan

Welco® AP519: Low Temperature No-Clean Printing Paste

Welco® AP519 T6 solder paste is a low temperature, state-of-the-art no-clean, lead-free solder paste formulated with Heraeus proprietary Welco® powder. It is specifically designed for processes that require a low peak reflow temperature of ≤170°C, including BGA, SMD component or flip chip attach processes for fine pitch semiconductor packages such as System-in-Package (SiP), Package-on-Package (PoP) etc.

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Welco® AP5112: Fine Pitch Solder Paste for SiP Applications

Continued miniaturization and the increase of complexity and functionality of packages drive the need for fine pitch solder pastes. Welco® AP5112 is a halogen-free water-soluble printing solder paste series, designed to address those challenges.

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AgCoat® Prime: Latest Technology Breakthrough:

Heraeus is the first in the market showcasing an innovative product that substitutes costly gold wires for memory packaging. AgCoat® Prime is a gold coated silver wire which provides uncompromised reliability and workability at lower total cost of ownership.

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mAgic® PE338: Pressure Ag Sinter Paste for Power Electronics Applications​

Key requirements for power electronics and therefore for the interconnects on DCB substrates are increased lifetime, low thermal resistance and elevated operation temperature. mAgic® PE338 achieves best results with high thermal performance.

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Expert Presentation at TechXPOT

Vito Hsu
  • Topic: Moving forward with Heraeus Electronics. Advanced Packaging. Sustainability. New Apllication Center
  • Date: 28 December 2021
  • Time: 3:00 - 3:20pm
  • Venue: 1F TechXPOT stage
  • Presenter: Mr. Vito Hsu, Senior Technical Solution Manager, Heraeus Electronics