With 5G, Internet of things (IoT), and Artificial Intelligence (AI) continue to disrupt and shape the semiconductor industry, new innovative material solutions are required to support the next generation packages.
Heraeus Electronics’ latest materials portfolio enables customers to develop new keys for higher current density, addressing integration challenges, and answering the demand for improved reliability, miniaturization and cost efficiency. Leveraging our new Advanced Packaging Application Center in Taiwan, local customers benefit from shorter development cycles, faster time to market, local technical expertise to solve complex systems, reduced development risks, and the efficient use of resources.
Stop by our booth to learn more:
- Date: 14 - 16 September 2022
- Venue: TaiNEX 1, Taipei
- Booth #L0426, 4F (Materials Pavilion)
