Date: 12 - 14 July 2022
Exhibition Location: Moscone Center, 747 Howard Street San Francisco, CA 94103
Booth number: 345
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Stay safe. We are looking forward to seeing you!
Heraeus Electronics at Semicon West 2022
Advanced Packaging - Enabling Miniaturization with Maximum Yield
Today’s electronics devices need to deliver more functionality with more processing power and greater speed. Module complexity is increasing, while devices have to miniaturize. Heraeus as a solution provider for the advanced packaging market offers materials for outstanding reliability, best performance and at the same time lower costs.Durability and service excellence increased.
Semicon West 2022 event information
Product highlights at Semicon West 2022
Welco AP519 T6 Solder Paste for SiP applications
AP520 T7 Water Soluble Solder Paste
AgCoat Prime: Gold-Coated Silver Bonding Wire
Welco AP5112: Fine Pitch Solder Paste for SiP applications
WelcoTM AP519 T6 Solder Paste for SiP applications (NEW!)
Key benefits:
- Low reflow peak temperature at ~170°C
- Reduced thermal warpage of die & substrate
- Reduced energy cost
- Best-in-class low void performance
- Excellent printability (volume consistency)
- Long stencil life & staging life
- Welco difference – less batch-to-batch variations
WelcoTM AP520 T7 Water Soluble Solder PasteFor next generation ultra fine pitch SiP applications (NEW!)
Key benefits:
- Fewer processing steps- lower CAPEX, labor and material costs
- Solder paste eliminates “white bond”, incomplete solder formation (due to substrate unevenness and/ or uneven Cu pillar heights)
- Reduce non-wet defects as much as 600 times
AgCoat® Prime: Gold-Coated Silver Bonding Wire
Key benefits:
- Gas-free FAB formation in bonding process
- Longer floor life (60 days) compared to Ag alloy wire
- Improves second bond workability
- Improved reliability performance on HTS and TC compared to Au wire
- Retain your existing facility infrastructure to avoid any CAPEX investment
- Reuse of existing ball bonders in your production floor
- Slower IMC growth rate compared to Au wire
WelcoTM AP5112: Fine Pitch Solder Paste for SiP applications
Key benefits:
- Good printability on fine pitch pad size
- Minimal solder splashing
- Good wetting performance
- Good cleaning properties
- Halogen-free
- Available in low alpha count SAC 305 alloy T6 and T7
- Available in Type 4 to 7 powders