Maximized Reliability with Perfectly Matched Materials

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2020-11-16 11:36:19

Meet Heraeus' experts at PCIM Asia 2020 and discuss your challenges!

PCIM Asia 2020

The power electronics assembly market evolves at a fast pace, competition gets keener. Heraeus enables its customers to reach key targets for the development of their innovations by optimizing materials and matched materials combinations.

  • Exhibition date: 16-18 Nov. 2020
  • Heraeus Booth No. Hall 2, Booth #C20
  • Venue: Hall 2, Shanghai World Expo Exhibition & Convention Center

 Find more information about PCIM Asia 2020.

Product Highlights at PCIM Asia for Power Electronic Applications

Condura.prime – AMB Si3N4 Substrates

Key Benefits

  • Increased life time due to highest reliablity
  • Improved power density
  • Lower thermal resistance
  • Proven increased mechanical robustness
  • Improved heat dissipation

 Find more information.

DBC-ZTA

  • Robustness enhancement through Zr doped Al2O3
  • Higher reliability compared to Condura®.classic (Al2O3) standard products
  • Mainly used in the medium power segment for advanced industry applications or power electronics for automotive

Die Top System

  • Die current capability increases> 50 % vs. Al-wire
  • Thermal cycle reliability increases > 10 x vs. solder die attach / Al-wire combination
  • Uniform temperature distribution across the die; hot spots avoided
  • Compatible for high temperature semiconductors, enabling high junction temperatures of 200 °C

 Find more information.

Condura+ with Pre-applied Solder

Key Benefits
  • 50 % fewer process steps for die soldering
  • Production cost savings - Lower investment in equipment and cleaning materials
  • Improved yield

 Find more information.

CucorAl PLUS Bonding Wire

Aluminum Cladded Copper Wire for Power Application

  • Increased reliability compared to standard aluminum material
  • Compatibility with standard bonding and standard
  • Chip technology
  • Superior electrical and thermal capabilities
  • Outstanding power cycling performance

 Find more information.

mAgic PE338

  • Pressure Sinter Paste
  • Optimized for SiC application

Key Benefits

  • Sinters on bare copper surface
  • Improved mechanical properties for higher reliability
  • Enables high operating temperature up to 250 °C

 Find more information.

mAgic DA295A

Non-Pressure Sinter Paste for Power Semiconductor application

  • Improves heat dissipation to enable operation at elevated temperature
  • Low temperature processing at 200 ⁰C
  • Improves open time performance for wider processing window

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Expert Presentation at PCIM Asia Forum

Heraeus Materials Solutions for Power Electronic Packaging

Dr. Liuchang Hu speaks about materials solutions for power electronic packaging
  • Date: 17th Novenber 2020, 11.10 - 11.30 AM
  • Venue: Shanghai World Expo Exhibition & Center
  • Topic: Heraeus materials solutions for power electronic packaging
  • Speaker: Dr. Liuchang Hu, Head of HET China Technical Solution Engineer

Heraeus Electronics is committed to providing matched material solutions for power electronic packaging, not only the dissipation solutions including the metal ceramic substrates and sintering materials for the chip back, but also a combination of Heraeus sintering materials and thick copper wires for the front of the chip. Besides, Heraeus also provides Die Top System (DTS) material solutions. In the overall package, the conductivity and heat dissipation have been greatly improved. Compared with the traditional material package, the power cycle reliability has increased by more than 50 times.

 More information about HET materials solutions and services for packaging of power electronic modules.

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