Maximized Reliability with Perfectly Matched Materials

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2020-11-16 11:36:19

Meet Heraeus' experts at PCIM Asia 2020 and discuss your challenges!

PCIM Asia 2020

The power electronics assembly market evolves at a fast pace, competition gets keener. Heraeus enables its customers to reach key targets for the development of their innovations by optimizing materials and matched materials combinations.

  • Exhibition date: 16-18 Nov. 2020
  • Heraeus Booth No. Hall 2, Booth #C20
  • Venue: Hall 2, Shanghai World Expo Exhibition & Convention Center

Find more information about PCIM Asia 2020.

Product Highlights at PCIM Asia for Power Electronic Applications

Expert Presentation at PCIM Asia Forum

Heraeus Materials Solutions for Power Electronic Packaging

Dr. Liuchang Hu speaks about materials solutions for power electronic packaging
  • Date: 17th Novenber 2020, 11.10 - 11.30 AM
  • Venue: Shanghai World Expo Exhibition & Center
  • Topic: Heraeus materials solutions for power electronic packaging
  • Speaker: Dr. Liuchang Hu, Head of HET China Technical Solution Engineer

Heraeus Electronics is committed to providing matched material solutions for power electronic packaging, not only the dissipation solutions including the metal ceramic substrates and sintering materials for the chip back, but also a combination of Heraeus sintering materials and thick copper wires for the front of the chip. Besides, Heraeus also provides Die Top System (DTS) material solutions. In the overall package, the conductivity and heat dissipation have been greatly improved. Compared with the traditional material package, the power cycle reliability has increased by more than 50 times.

More information about HET materials solutions and services for packaging of power electronic modules.

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