DCBs consist of a ceramic substrate such as Al2O3 (aluminium oxide) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling.
Heraeus Condura®.classic substrates have an excellent performance/cost efficiency ratio. The great heat conductivity of Al2O3 (24 W/mK) as well as the high heat capacity make Condura®.classic irreplaceable in power electronics. The thick copper foils offer extremely good electrical and thermal conductivity and form an outstanding base for the soldering and wire bonding processes.
We assure a perfect match between the substrate, its functional surfaces, the chip attachment and a whole range of materials used in assembly and packaging technologies. Use the Heraeus experience to find the best solution for your challenges.