Condura®.classic - DCB-Al2O3 substrates

The Direct Copper Bonding Substrate (DCB, also knows as DBC) is the long-proven standard for power electronic modules in industrial, home-appliances and automotive applications.

DCB - Direct Copper Bonding

DCBs consist of a ceramic substrate such as Al2O3 (aluminium oxide) serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling.

Heraeus Condura®.classic substrates have an excellent performance/cost efficiency ratio. The great heat conductivity of Al2O3 (24 W/mK) as well as the high heat capacity make Condura®.classic irreplaceable in power electronics. The thick copper foils offer extremely good electrical and thermal conductivity and form an outstanding base for the soldering and wire bonding processes.

We assure a perfect match between the substrate, its functional surfaces, the chip attachment and a whole range of materials used in assembly and packaging technologies. Use the Heraeus experience to find the best solution for your challenges.

Condura®.classic substrates based on aluminium oxide ceramic have an excellent performance/cost efficiency ratio. The thick copper foils offer extremely good electrical and thermal conductivity and form an outstanding base for the soldering and wire bonding processes.

Advantages of Condura®.classic at a glance:

  • Low ink rate and high level of quality consistency
  • Low contamination with metal or ceramic particles
  • Fast delivery of new DCB layouts for standard material combinations – five days following clarification of drawing and receipt of order within Europe, outside of Europe 15 days

Your advantages in working with Heraeus:

  • Exactly the right solution for your application, adapted to your needs
  • Quicker time to market due to unique expertise
  • Capability to test all adaptations in our in-house application center
  • High innovation capabilities

Power electronics in industrial use:

Our Condura®.classic substrates are recommended for power electronic modules (e.g. current inverters) using MOSFETs or IGBT semiconductor elements and diodes for widespread application fields in the industrial sector: electric motor drives, e.g. in tooling machines, cranes, textile-processing equipment, automation equipment, etc.

  • Pumps
  • Welding machines
  • Electrical industrial vehicles (e.g. power drives for forklifts)
  • Induction heating
  • Industrial drives (e.g. escalators, conveyor belts, elevators, robots, and servo drives)
  • Uninterruptable power supply to. data centers, hospitals, etc.
  • Energy technology (e.g. photovoltaics, wind turbines, and energy distribution)
  • White goods (e.g. air conditioners, washing machines, refrigerators, and warm water pumps)

Automotive and traction:

As high-performance circuit carriers for power electronic applications:

  • In such groups as power steering, start-stop systems, air conditioning compressors, water pumps, oil pumps, brakes, etc.
  • Converters for hybrid or electrical power train
  • Battery chargers
  • Inductive charging systems
  • DC-DC converters
  • Rail vehicles such as locomotives, subway trains, trams and cable cars, etc.


  • Uninterruptable power supply (UPS) to telecommunication centers (e.g. RF amplification systems)

Further markets:

There are many examples of further markets in which DCBs are already being applied, such as medical technology (MRT, CRT), aerospace, radar systems, heavy building machinery, and looking towards the future, increasingly in agricultural vehicles and aircraft.

Combinations of materials:

We offer you the following standard material combinations:

  • Cu / Al2O3 / Cu: 0.3 / 0.38 / 0.3 mm
  • Cu / Al2O3 / Cu: 0.3 / 0.63 / 0.3 mm

Other combinations are available upon request:

  • Alumina ceramic Al2O3 (96%) thicknesses: 0.25 mm / 0.32 mm / 0.38 mm / 0.63 mm
  • Copper-OFE thicknesses: 0.2 mm / 0.25 mm / 0.3 mm / 0.4 mm
  • Single unit or master card size 7 ″ x 5 ″ (usable area)
  • Surface finish: bare Cu, Ni, Ni/Au (others planned)

Surface properties:

We can meet your request for an optimization of the surfaces or process parameters (either in a standard form or in a form developed jointly with you) for soldering, sintering, wire or ribbon bonding.

Technical data for surface coating:

Coating process Thickness of the coating [μm]
Electroless Ni 3 - 7 (8 % ±2 % P)
Immersion Au (ENIG, Au Class 1) 0.01 - 0.05
Immersion Au (ENIG, Au Class 2) 0.03 - 0.13

Further technical details can be taken from the  Development Product Information Sheet (DPIS).