Join Heraeus Electronics at APEX 2023

Heraeus at NEPCON Japan 2023​

Heraeus Electronic returns to NEPCON Japan after two years of the pandemic. This year, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Stop by at our booth and learn our latest material.

  • Exhibition date: 25 - 27 January 2023
  • Heraeus Booth No. 25-36
  • Venue: Tokyo Big Sight, Japan​
  • Exhibition Zone: 24th IC & Sensor Packaging Technology Expo​

Go to:

New product highlights for semiconductor packaging

Other product highlights for power modules