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Heraeus Electronics at PCIM Asia 2021

The power electronics assembly market evolves at a fast pace, and competition becomes more intense. The power semiconductor industry is undergoing a technology revolution, led by Wide Band-gap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN), to enable higher power densities and switching frequencies. However, these challenges and requirements cannot be met by the prevailing power electronics packaging technologies and solutions, which have become a bottleneck to achieve the best result in WBG semiconductors. Therefore, the next-generation packaging materials and matched solutions are key to the WBG-enabled transformation. With Heraeus Electronics, customers reach key targets for the development of their innovations by optimizing materials and matched materials combinations.

  • Exhibition date: 9 - 11 September 2021
  • Heraeus Booth No. Hall 11, Booth #D42
  • Venue: Hall 11, Shenzhen World Exhibition & Convention Center

More information about PCIM Asia 2021

Product Highlights at PCIM Asia for Power Electronic Applications

Expert Presentation at PCIM Asia Forum

Advanced Packaging Solutions for SiC Based EV Inverter System

  • Date: 9th September 2021, 15:10 - 15:30
  • Venue: Hall 11, Shenzhen World Exhibition & Convention Center
  • Topic: Advanced Packaging Solutions for SiC Based EV Inverter System
  • Speaker: Dr. Jing Zhang, Director of innovation China, Heraeus Electronics

Power solutions for eMobility require miniaturization, energy efficiency and higher reliability. These requirements accelerated SiC power device adoption in many applications to enable higher power densities and switching frequencies. Therefore, it is important to develop suitable packaging materials and solutions to maximize the benefit of such device to cope with its increasing power density and operating temperature. Moreover, reduced parasitic inductance and maximized system reliability are also the key requirements. In this presentation, Heraeus Electronics will provide a full packaging solution for SiC power devices adopting novel packaging materials, including silver sinter materials, high reliability metal ceramic substrate and Die Top System (DTS). We will further show how and to what extent this solution can maximize the packaging performance.

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