The power electronics assembly market evolves at a fast pace, and competition becomes more intense. The power semiconductor industry is undergoing a technology revolution, led by Wide Band-gap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN), to enable higher power densities and switching frequencies. However, these challenges and requirements cannot be met by the prevailing power electronics packaging technologies and solutions, which have become a bottleneck to achieve the best result in WBG semiconductors. Therefore, the next-generation packaging materials and matched solutions are key to the WBG-enabled transformation. With Heraeus Electronics, customers reach key targets for the development of their innovations by optimizing materials and matched materials combinations.
- Exhibition date: 9 - 11 September 2021
- Heraeus Booth No. Hall 11, Booth #D42
- Venue: Hall 11, Shenzhen World Exhibition & Convention Center