DCBs consist of a ceramic substrate such as Al2O3 or ZTA serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling.
Heraeus premium alumina DCB substrates have an excellent performance/cost efficiency ratio. The thick copper foils offer extremely good electrical and thermal conductivity and form an outstanding base for the soldering and wire bonding processes. In addition, Heraeus offers with DCB+ a comprehensive portfolio of features and services to functionalize your substrates, simplify your process, enhance your productivity and support your product development cycle. Choose your solution out of 15 options to maximize your results.
We assure a perfect match between the substrate, its functional surfaces, the chip attachment and a whole range of materials used in assembly and packaging technologies. As experts of long standing, we offer you support in the development stages, and in doing so, help to save you both time and money.