Direct Copper Bonding – DCB and DCB+

Direct Copper Bonding Substrates (DCB, also known as DBC) are suited to high power applications (high currents/voltages) that in turn demand a high level of heat dissipation. The major challenge lies in processing higher power in increasingly smaller chip sizes. The new DCB+ with its 15 solutions maximize your flexibility in power electronics module production.

DCBs consist of a ceramic substrate such as Al2O3 or ZTA serving as an insulating layer, and copper connections to ensure the electrical conductivity at high temperatures. For optimal reliability and performance, the module must demonstrate good properties in relation to heat dissipation to the heat sink and endurance against thermal cycling and power cycling.

Heraeus premium alumina DCB substrates have an excellent performance/cost efficiency ratio. The thick copper foils offer extremely good electrical and thermal conductivity and form an outstanding base for the soldering and wire bonding processes. In addition, Heraeus offers with DCB+ a comprehensive portfolio of features and services to functionalize your substrates, simplify your process, enhance your productivity and support your product development cycle. Choose your solution out of 15 options to maximize your results.

We assure a perfect match between the substrate, its functional surfaces, the chip attachment and a whole range of materials used in assembly and packaging technologies. As experts of long standing, we offer you support in the development stages, and in doing so, help to save you both time and money.

DCB substrates based on aluminium oxide ceramic have an excellent performance/cost efficiency ratio. The thick copper foils offer extremely good electrical and thermal conductivity and form an outstanding base for the soldering and wire bonding processes.

Advantages of DCB at a glance:

  • Low ink rate and high level of quality consistency
  • Low contamination with metal or ceramic particles
  • Fast delivery of new DCB layouts for standard material combinations – five days following clarification of drawing and receipt of order within Europe, outside of Europe 15 days

Advantages of DCB+ at a glance:

  • Solutions can be tailor-made to meet specific demands
  • Pre-tested solutions
  • Optimization of the surfaces or process parameters (either in a standard form or in a form developed jointly with you) for soldering, sintering, wire or ribbon bonding

Your advantages in working with Heraeus:

  • Exactly the right solution for your application, adapted to your needs
  • Quicker time to market due to unique expertise
  • Capability to test all adaptations in our in-house application center
  • High innovation capabilities

Power electronics in industrial use:

Our DCB+ substrates are recommended for power electronic modules (e.g. current inverters) using MOSFETs or IGBT semiconductor elements and diodes for widespread application fields in the industrial sector: electric motor drives, e.g. in tooling machines, cranes, textile-processing equipment, automation equipment, etc.

  • Pumps
  • Welding machines
  • Electrical industrial vehicles (e.g. power drives for forklifts)
  • Induction heating
  • Industrial drives (e.g. escalators, conveyor belts, elevators, robots, and servo drives)
  • Uninterruptable power supply to. data centers, hospitals, etc.
  • Drillings for natural resources (e.g. oil and gas)
  • Energy technology (e.g. photovoltaics, wind turbines, and energy distribution)
  • White goods (e.g. air conditioners, washing machines, refrigerators, and warm water pumps)

Automotive and traction:

As high-performance circuit carriers for power electronic applications:

  • In such groups as power steering, start-stop systems, air conditioning compressors, water pumps, oil pumps, brakes, etc.
  • Converters for hybrid or electrical power train
  • Battery chargers
  • Inductive charging systems
  • DC-DC converters
  • Rail vehicles such as locomotives, subway trains, trams and cable cars, etc.

Communications:

  • Uninterruptable power supply (UPS) to telecommunication centers (e.g. RF amplification systems)

Further markets:

There are many examples of further markets in which DCBs are already being applied, such as medical technology (MRT, CRT), aerospace, radar systems, heavy building machinery, and looking towards the future, increasingly in agricultural vehicles and aircraft.

Combinations of materials:

We offer you the following standard material combinations:

  • Cu / Al2O3 / Cu: 0.3 / 0.38 / 0.3 mm
  • Cu / Al2O3 / Cu: 0.3 / 0.63 / 0.3 mm

Other combinations are available upon request:

  • Alumina ceramic Al2O3 (96%) thicknesses: 0.25 mm / 0.32 mm / 0.38 mm / 0.63 mm
  • Copper-OFE thicknesses: 0.2 mm / 0.25 mm / 0.3 mm / 0.4 mm
  • Single unit or master card size 7 ″ x 5 ″ (usable area)
  • Surface finish: bare Cu, Ni, Ni/Au (others planned)

Surface properties:

We can meet your request for an optimization of the surfaces or process parameters (either in a standard form or in a form developed jointly with you) for soldering, sintering, wire or ribbon bonding.

Technical data for surface coating:

Coating process Thickness of the coating [μm]
Electroless Ni 3 - 7 (8 % ±2 % P)
Electroless Ni/Au Ni 3 - 7 (8 % ±2 % P)
Au Au Class 1: 0.01 - 0.05
Au Au Class 2: 0.03 - 0.13

Further technical details can be taken from the technical datasheet .

DCB+

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