Creating Possibilities for Advanced EV and Automotive Applications
Heraeus Electronics at APEC 2021
The Applied Power Electronics Conference (APEC) will take place virtually from 14 - 17 June 2021.
The APEC focuses on the practical and applied aspects of the power electronics business. This is not just a designer’s conference; APEC has something of interest for anyone involved in power electronics.
Heraeus Electronics is bringing its expertise for the Power Electronics industry to APEC in 2021. New applications like electromobility or renewable energy present enormous challenges for power electronics devices. With these new applications requirements are becoming more demanding as well. Temperatures up to 200ºC, durability requirements of more than 10 years, and everything as cost effective as possible you need a reliable partner to help you achieve these goals. Heraeus Electronics offers the systems know how to get the most out of your power module. Our team of dedicated engineers utilize our materials to create the best solution for your design with superior performance and cost in mind.
Join Heraeus Electronics Live On-Demand Conference
ES13 - Advanced Materials Solutions for EV/Automotive Electronics
Location: Social 27 Virtual Conference Platform
Speaker: Mr Habib Mustain, Power Electronics Segment Manager
Heraeus Electronics, a leading provider of material solutions for electronics packaging provides perfectly matched materials. This allows manufacturers to optimize performance and reliability of their products. Heraeus Electronics is the only company in the market that offers broader product portfolio for power electronics assembly – from bonding wires, sinter pastes to substrates and combining them to increase the performance of their power modules and assembly.
Microbond® PE830 solder paste is designed for the use of die attach in power electronic modules. The revolutionary flux system incorporates synthetic resins that eliminate batch to batch variances and allows supply chain stability. As a result, the total cost of ownership (TCO) can be reduced through constantly high yield of sub-assemblies. These are realized by outstanding low void performance, low splashing rate as well as low die tilt and rotation. The product will be available with Tin-Silver alloy. In addition, the flux residues are easy to clean with standard cleaning agents.
Low batch to batch variance and supply chain stability through synthetic resin
Outstanding low voids performance
Minimal solder splashing
Low tilt and rotation of dies
Good cleaning properties
Reduction of total cost of ownership through high yield of production
More products at the show
PowerCu Soft Ribbon
Die Top System (DTS®)
Condura® Prime : Active Metal Brazed
Excellent mechanical properties and a high thermal conductivity of AMB-Si3N4 substrates make Condura®.prime an ideal material for high-reliable power electronics modules.
Increased life time due to highest reliablity
Improved power density
Lower thermal resistance (by a factor 4 compared to Condura®.classic)
mAgic® PE338 : Pressure Ag Sinter Paste for Power Electronics Applications
Key requirements for power electronics and therefore for the interconnects on DCB substrates are increased lifetime, low thermal resistance and elevated operation temperature. mAgic® PE338 achieves best results with high thermal performance.
Improves device reliability
High thermal conductivity for longer lifetime
High electrical conductivity improves device efficency
Enables high operating temperature
Lead-free and halogen zero formulation for environmental compliance
PowerCu Soft : Copper Power Bonding Wires and Ribbons
The outstanding properties of large-diameter copper bonding wires and ribbons from Heraeus' PowerCu Soft family let you solve many technical challenges in electronics applications while at the same time reducing costs.
Replace up to 3 single wires (UPH improvement)
Higher power density
Advanced mechanical and electrical properties
Able to resist high temperature and mechanical stress
DTS® makes copper wire bonding possible without breaking the die and combines it with sinter technology. It significantly improves the electrical and thermal conductivity, the reliability of the die connection and optimizes the entire module performance. Its industrialization is straightforward thanks to the pre-applied sinter paste and the sintering of die and DTS® together in one process. Profiting from the flexibility of the wire bonding technology, the same production equipment can cover all layout variances. Altogether, DTS® maximizes profitability and helps to bring the next generation of power modules to market faster.
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