Die top contact, mostly relying on aluminum wire bonding, remains a bottleneck to meet the requirements for higher operating temperatures and enhanced reliability. To address this issue, Heraeus developed the Die Top System (DTS®), which is a material system for assembly and connection technology.
DTS® makes copper wire bonding possible without breaking the die and combines it with sinter technology. It significantly improves the electrical and thermal conductivity, the reliability of the die connection and optimizes the entire module performance. Its industrialization is straightforward thanks to the pre-applied sinter paste and the sintering of die and DTS® together in one process. Profiting from the flexibility of the wire bonding technology, the same production equipment can cover all layout variances. Altogether, DTS® maximizes profitability and helps to bring the next generation of power modules to market faster.