Power Electronics -
Maximized Reliability with Perfectly Matched Materials

Junction temperatures up to 200 °C, durability requirements of more than 10 years, and everything as cost-effective as possible: New applications such as electromobility or renewable energy represent enormous challenges for power electronics devices. Power modules using Wide Band-gap (WBG) silicon carbide (SiC) and gallium nitride (GaN) technologies are being developed to enable higher power densities and switching frequencies. Traditional assembly and packaging materials such as solder are reaching their limits.
Make use of next generation, perfectly matched assembly and packaging materials to maximize the system reliability.

Systems Know How for Power Electronics

Heraeus Die Top System (DTS®) – Get more out of your power module!
Heraeus Die Top System (DTS®) – Get more out of your power module!

Die top contact, mostly relying on aluminum wire bonding, remains a bottleneck to meet the requirements for higher operating temperatures and enhanced reliability. To address this issue, Heraeus developed the Die Top System (DTS®), which is a material system for assembly and connection technology.

DTS® makes copper wire bonding possible without breaking the die and combines it with sinter technology. It significantly improves the electrical and thermal conductivity, the reliability of the die connection and optimizes the entire module performance. Its industrialization is straightforward thanks to the pre-applied sinter paste and the sintering of die and DTS® together in one process. Profiting from the flexibility of the wire bonding technology, the same production equipment can cover all layout variances. Altogether, DTS® maximizes profitability and helps to bring the next generation of power modules to market faster.

Find here more information about Heraeus' DTS®

Experience the difference - Heraeus Materials for Wirebonding

Rely on our Solutions for Die Attach/ Component Attach

Choose the right Base for your Power Electronic Module

Further Solutions from Heraeus for Power Electronics

Interested to discuss your challenge with our expert? Meet us!

Layout by courtesy of Fraunhofer IISB

Attend our Sinter Seminar!

19th – 20th March 2020
Heraeus in Hanau, Germany