With the trend towards miniaturization the number of components in SiP are increasing while package size gets smaller. Driven by the form factor advanced packaging for consumables such as mobile phones, the challenges of interconnect become bigger and bigger. The race to 5G connectivity dominance also forces the world’s leading semiconductor companies to seek cutting edge interconnect technology enabling them to create high performance devices with greater reliability.
Heraeus has been a leading materials supplier to the semiconductor industry for decades. Widely known as a technology leader for bonding wires, we have been tackling the next technological challenge in semiconductor packaging and developed best-in-class advanced packaging solutions.
Heraeus offers an excellent solder paste called Welco™ AP5112 specially developed for ultra-fine pitch applications with best-in-class void performance. Through all in one printing processing steps are reduced and SiP assembly processing becomes simplified. With its Welco™ technology Heraeus offers powder for Type 6, 7 and beyond.
We offer comprehensive application services in our state-of-the-art application center in Singapore. This makes it possible for our customers to test on modern machines and to receive results quickly. Our experienced engineers in packaging solutions will assist you and your team to succeed.