Advanced Packaging at Heraeus Electronics

Advanced Packaging - Enabling Miniaturization with Maximum Yield

Today’s electronics devices need to deliver more functionality with more processing power and greater speed. Module complexity is increasing, while devices have to miniaturize. Heraeus as a solution provider for the advanced packaging market offers materials for outstanding reliability, best performance and at the same time lower costs.

Continuing a Strong Bond With Heraeus Advanced Packaging Solutions

Heraeus Materials for Advanced Packaging
Heraeus Materials for Advanced Packaging

With the trend towards miniaturization the number of components in SiP are increasing while package size gets smaller. Driven by the form factor advanced packaging for consumables such as mobile phones, the challenges of interconnect become bigger and bigger. The race to 5G connectivity dominance also forces the world’s leading semiconductor companies to seek cutting edge interconnect technology enabling them to create high performance devices with greater reliability.

Heraeus has been a leading materials supplier to the semiconductor industry for decades. Widely known as a technology leader for bonding wires, we have been tackling the next technological challenge in semiconductor packaging and developed best-in-class advanced packaging solutions.

Heraeus offers an excellent solder paste called Welco™ AP5112 specially developed for ultra-fine pitch applications with best-in-class void performance. Through all in one printing processing steps are reduced and SiP assembly processing becomes simplified. With its Welco™ technology Heraeus offers powder for Type 6, 7 and beyond.

 Find about more about Welco™ AP5112.

We offer comprehensive application services in our state-of-the-art application center in Singapore. This makes it possible for our customers to test on modern machines and to receive results quickly. Our experienced engineers in packaging solutions will assist you and your team to succeed.

Heraeus Solder Paste – Outstanding Performance for Advanced Packaging

Heraeus Bonding Wires - The long proven Standard in System-in-Package

Heraeus Printed Electronics - System Solution for EMI Shielding

Interested to discuss your challenge with our expert? Meet us!