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Market Insights

02.12.2019

Toralf Eggert appointed Head of Heraeus Additive Manufacturing

Toralf Eggert heads the Heraeus Additive Manufacturing (H3D) division since December 1. In this position, he succeeds Tobias Caspari, who will take over other tasks within the Group.

Heraeus presents new ultra-thin lead frame to increase security for ID cards

Heraeus Electronics today announced the launch of a new ultra-thin lead frame with the product name XOB10. The product is used for Radio Frequency Identification (RFID) systems.

Amorphous metals allow weight savings in high-performance components for vehicles of tomorrow

With their material properties, amorphous metals offer solutions for vehicles of tomorrow. Dr. Jürgen Wachter, Head of Heraeus AMLOY, gave an inspiring lecture on this topic at the ATZ live conference in Frankfurt. How amorphous metals can contribute to weight reduction in vehicle construction is explained in his paper.

Die Top System - Whitepaper by Dr. Christophe Fery

Heraeus Die Top System

Due to continuous rise in power density, coupled with higher operating temperatures and demand for improved reliability, die attach & interconnection using solder and Al wire are facing their limits.

Electromobility

Platinum temperature sensors and solutions for electromobility. Innovative strength and agility to succeed in the market.

Sensor Challenges in Future Markets

The goal is to reap the greatest benefit and eliminate waste. This is the only way to meet the growing demands of tomorrow’s world without destroying it. Precise control is the key. And the key to control is precise data.